IEEE DAPPS 2026
The 8th IEEE International Conference on Decentralized Applications and Infrastructures
July 27-30, 2026 | Fukuoka, Japan
The 8th IEEE International Conference on Decentralized Applications and Infrastructures (IEEE DAPPS 2026) aims to bring together researchers and industry professionals working on decentralized applications (dApps), Blockchain and Distributed Ledger Technologies. The event is part of the larger IEEE CISOSE 2026 congress and focuses on the practical and theoretical advancements in decentralized systems.
While Blockchain is well-known for its role in digital payments and cryptocurrencies, its broader potential lies in creating decentralized applications (dApps) that can revolutionize various industries across domains such as supply chains, certificate management, and data sovereignty. dApps provide secure, transparent, and tamper-resistant solutions for peer-to-peer transactions, eliminating the need for a trusted central authority.
IEEE DAPPS 2025 will focus on key topics such as decentralized algorithms, infrastructure, and real-world deployments. The conference will offer a platform to discuss innovations, challenges, and future directions in the development and use of dApps across industries.
The conference organizers are currently undergoing an approval process for a journal special issue on the conference topic, thus creating an opportunity for publishing an extended version of the conference papers.
This year’s conference is scheduled to take place in Fukuoka, Japan, from 27-30, July 2026. The conference is part of IEEE CISOSE 2026 congress.
General Chairs
Gengrui Zhang, Concordia University
Xiaojie Zhu, King Abdullah University of Science and Technology (KAUST)
Program Committee Chair
Abdelhakim Senhaji Hafid, University of Montreal
Local Chairs
Hiroyuki Fujioka, Fukuoka Institute of Technology
Hiroyuki Sato, The University of Tokyo
Publications Chair
Stephen Fan, The King’s University
Publicity Chair
Sara Rouhani, École de technologie supérieure (ÉTS Montréal)
Steering Committees
Kaiwen Zhang, École de technologie supérieure (ÉTS Montréal)
Wei-Tek Tsai, Arizona State University
Stefan Schulte, TU Berlin